金山科研平台现货促销

ULVAC爱发科 热导率测量系统 STPM-1000 扫描型热探针微图像

ULVAC爱发科 热导率测量系统 STPM-1000 扫描型热探针微图像

材料的面内分布评价、分析。本装置能够同时测量泽贝克系数和导热系数的面内二维分布。能在20μm节距进行材料图谱分析。金山科研平台现货促销特点

可以在20μm间距进行分布分析评估

使用标准物质进行校准可以提高导热系数的准确度

金山科研平台现货促销用途

热电材料的简单性能评估

功能分级的材料的热特性分布评估

无机材料，高分子材料和结晶材料的均匀性评估

实际使用材料（印刷电路板，多层板等）的缺陷评估

金山科研平台现货促销规格TypeMeasurement temperatureMaximum sample sizeAccuracy of Seebeck coefficientAccuracy of thermal conductivity*Measurement time at one pointLocal resolutionResolution of position controlSample moving distance

STPM-1000

RT + 5℃

Square 20 mm × Thickness 5 mm

±10%　(by single bulk sample with thickness 1mm)

±50%　(by single bulk sample with thickness 1mm)

less than 10 s.

20μm

1μm

x-axis 50 mm, y-axis 50 mm, z-axis 10 mm

*Thermal conductivity of unknown sample can be estimated by reference sample of known thermal conductivity and comparison calibration.

Measurement principle

Seebeck coefficientCalculate from voltage difference (ΔV) and temperature difference (ΔV) beteween temperature at contact pointT_cpandT₃.(Tcp is calculated fromT₁andT₂.)

Thermal conductivityCalculate from T1 - T2.

Measurement examples

Seebeck coefficient and thermal conductivity distribution and composition dependence of Seebeck coefficient and thermal conductivity of (Bi_1-xSb_x)₂Te₃(0.5<x<1)

Seebeck coefficient distribution

Thermal conductivity distribution

Composition dependence of Seebeck coefficient

Composition dependence of thermal conductivity

Applications

Simple performance evaluation of thermoelectric materials

Thermal property distribution evaluation of functionally graded materials

Homogeneity evaluation of inorganic materials, polymer materials and crystalline materials

Defect assessment of practical materials (Print substrate, multilayer substrate etc.)

UtilityPower supplyExternal dimensionsWeightSpace requirement

AC 100V 15A (excluding PC)

W510 × D650 × t460 (mm)

Approx. 70kg

Approx. W1200 × D900 (mm) for table